PRODUCT TECHNOLOGY

Product Application

Process Capability

Production Equipment

Inspection equipment

Process Capability

Project

Item

Ability

Capability

Project

Item

Ability

Capability

Number of layers

 No. of Layer

1－28Layer

Outer design line width/spacing (minimum)

Design Line Width/Space of Outer Layer (Min)

3.5mil ( 0.089mm)

Finish plate size (max)

Finished Board Size (Max)

18.4 ″ × 23.62 ″(468mm × 600mm)

Inner design linewidth/spacing (minimum)

Design Line Width/Space of Inner Layer (Min)

3.5mil ( 0.089mm)

Finish plate size (minimum)

Finished Board Size (Min)

3.0 ″ × 2.0 ″(76mm × 51mm)

Outer layer alignment accuracy

Outer layer contraposition precision

±1.5mil ( ±0.038mm)

Plate thickness (max)

Board Thickness (Max)

0.126″(3.2mm)

Solder resistance alignment accuracy

SM contraposition precision 

±1.5mil ( ±0.038mm)

Plate thickness (minimum)

Board Thickness (Min)

0.016″ (0.4mm)

Forming accuracy

Routingprecision 

±4mil (± 0.1mm)

Borehole diameter (minimum)

Drilling Hole Diameter（Min）

ф0.008″ (0.20mm)

Inner copper thickness (max.)

Inner copper thickness(Max)

3OZ

Drilling position accuracy

Drilling precision 

±2mil ( ±0.05mm)

Outer copper thickness (max.)

Outer copper thickness(Max)

4OZ

Hole diameter tolerance (plated through hole)

Hole Diameter Tolerance (PTH)

±3mil ( ±0.076mm)

Distance from inner hole to line

Distance from hole to track of inner layer 

7mil

Hole diameter tolerance (non-plated through hole)

Hole Diameter Tolerance (NPTH)

±2mil ( ±0.051mm)

Width of solder resist bridge (minimum)

Width of SM dam（Min）

3mil